Title :
Seeing inside chips and cells: high-resolution subsurface imaging of integrated circuits, quantum dots and subcellular structures
Author :
Goldberg, B.B. ; Swan, A.K. ; Moiseev, L. ; Dogan, M. ; Karl, W.C. ; Davis, Brian ; Cantor, C.R. ; Ippolito, S.B. ; Thorne, S.A. ; Liu, Zhe ; Goldberg, M.B. ; Unlu, M.S. ; Leblebici, Yusuf
Author_Institution :
Dept. of Phys., Boston Univ., MA
Abstract :
In this work we examine two general approaches to subsurface imaging, the first using solid immersion lens technology to optimize the numerical aperture and the second an interferometric spectral fluorescence technique for buried emitters
Keywords :
failure analysis; fluorescence; integrated circuit testing; integrated circuits; lenses; light interferometry; nondestructive testing; quantum dots; buried emitters; high-resolution subsurface imaging; integrated circuits; interferometric spectral fluorescence technique; numerical aperture; quantum dots; solid immersion lens technology; subcellular structures;
Conference_Titel :
Quantum Electronics Conference, 2004. (IQEC). International
Conference_Location :
San Francisco, CA
Print_ISBN :
1-55752-778-4
