• DocumentCode
    20863
  • Title

    A 600 V High-Voltage IC Technique With a New Self-Shielding Structure for High Noise Tolerance and Die Shrink

  • Author

    Yamaji, Masaharu ; Jonishi, Akihiro ; Tanaka, Takahide ; Sumida, Hitoshi ; Hashimoto, Yoshio

  • Author_Institution
    Dept. of Device DevelopmentElectronic Devices Bus. Group, Fuji Electr. Co., Ltd., Matsumoto, Japan
  • Volume
    62
  • Issue
    5
  • fYear
    2015
  • fDate
    May-15
  • Firstpage
    1524
  • Lastpage
    1529
  • Abstract
    A novel 600 V high-voltage IC (HVIC) featuring a high noise tolerance is proposed. The purpose of the proposed HVIC is to achieve the high noise tolerance without an increase of the fabrication cost. The basic device concept is to arrange a P- separation layer around the high-side control part, which is called a new self-shielding structure, to reduce a hole current injection under the condition of negative transient voltage noise. By applying the new self-shielding structure in the HVIC, more than 3× higher noise tolerance (-95 V/1 μs) and 20% die shrink can be obtained compared with a conventional HVIC, without additional fabrication process. This means the noise tolerance of the fabricated HVIC with proposed structure is high enough to be applied to over 600 V/50-A class power conversion applications. In this paper, the new self-shielding concept of the proposed 600 V-class HVIC is presented with the simulation and experimental results.
  • Keywords
    integrated circuit design; integrated circuit noise; power integrated circuits; shielding; HVIC; P- separation layer; current 50 A; die shrink; high noise tolerance; high-voltage IC; hole current injection; negative transient voltage noise; power conversion applications; self-shielding structure; voltage 600 V; Fabrication; Integrated circuits; Logic gates; Noise; Silicon; Transient analysis; Voltage measurement; 600 V; high-voltage IC (HVIC); noise tolerance; self-shielding; self-shielding.;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2015.2414923
  • Filename
    7083762