Title :
Microsolder ball incorporated nanofiber anisotropic conductive adhesives (microsolder/nanofiber ACAs)
Author :
Kyoung-Lim Suk ; Kyung-Woo Paik
Author_Institution :
Dept. of Mater. Sci. & Eng., KAIST, Daejeon, South Korea
fDate :
Feb. 27 2013-March 1 2013
Abstract :
We suggest and investigate a new concept of nanofiber ACA that incorporates microsolder balls into nanofiber to obtain stable three-dimensional electrical properties of fine pitch electronics. This adhesive offers many advantages, such as suppressing microsolder ball movement during resin flow, perfect X-Y axes insulation at 25 μm fine pitch, and easy fine solder ball handling. Microsolder balls can be successfully incorporated into a nanofiber structure through an electrospinning process, and they have good solderability within the nanofiber/epoxy matrix.
Keywords :
conductive adhesives; electrospinning; fine-pitch technology; soldering; X-Y axes insulation; electrospinning process; fine pitch electronics; microsolder ball; nanofiber ACA; nanofiber anisotropic conductive adhesives; nanofiber-epoxy matrix; resin flow; solder ball handling; three-dimensional electrical properties; Abstracts; Market research; Nanostructures; Needles; Silicon;
Conference_Titel :
Advanced Packaging Materials (APM), 2013 IEEE International Symposium on
Conference_Location :
Irvine, CA
Print_ISBN :
978-1-4673-6093-7
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2013.6510399
