A novel PoP model with thermal reliability

As increasing harsher requirements are brought in to meet the specification for the volume and the area, the integration level of systems tends to be denser and then a high density package, known as Package-on-Package (PoP), comes into being. However, the high density PoP also brings about negative effects at the same time, of which poor heat dissipation inclines to make chip overheat and therefore cause thermal damage. Hence, this paper introduces a novel thermal reliable PoP model with a new kind of secondary heat dissipation structure to achieve the purpose of decreasing the junction temperature of the package, by reducing the thermal resistance between the chip and secondary cooling structure.