DocumentCode
2087752
Title
Coupled finite element analysis of super heat resistant ceramic insulated wire
Author
Grise, WilliamR ; Zargari, Ahmad
Author_Institution
Dept. of IET, Morehead State Univ., Morehead, KY, USA
fYear
1997
fDate
22-25 Sep 1997
Firstpage
219
Lastpage
227
Abstract
A coupled finite element analysis is used to understand the role of high ambient temperatures in promoting the growth of fatigue cracks in the various layers of super heat resistant ceramic insulated wire. Comparisons are made among three types of composite conductors. In all three, the core conductor material is copper. A second layer, moving outward from the center, uses either niobium or tantalum. The final portion of the composite conductor is formed of either nickel or titanium. These outer layers of the conducting portion of the wire are necessary to prevent diffusion of metal atoms from the conductor into the ceramic insulation which surrounds the composite conductor. The ceramic layer is made of alumina. After determining the state of stress and strain in the wire due to a series of high temperatures, cracks of varying initial sizes are placed in the material and a specialized finite element program, FRANC2DL, is used to analyze the path of the crack and the fatigue failure
Keywords
alumina; ceramic insulation; copper; fatigue cracks; finite element analysis; heat transfer; insulated wires; nickel; niobium; stress analysis; tantalum; titanium; Al2O3; Cu-Nb-Ni; Cu-Nb-Ni wire; Cu-Nb-Ti; Cu-Nb-Ti wire; Cu-Ta-Ni; Cu-Ta-Ni wire; FRANC2DL; alumina; composite conductors; copper core conductor material; coupled finite element analysis; fatigue cracks growth; finite element program; fracture analysis; heat conduction; heat transfer; high temperatures; nickel; niobium; strain; stress; super heat resistant ceramic insulated wire; tantalum; titanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference, 1997, and Electrical Manufacturing & Coil Winding Conference. Proceedings
Conference_Location
Rosemont, IL
ISSN
0362-2479
Print_ISBN
0-7803-3959-2
Type
conf
DOI
10.1109/EEIC.1997.651045
Filename
651045
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