Title :
Building true logic LNVM with automotive-level reliability
Author :
Horch, Andrew ; Wang, Bin ; Niset, Martin ; Hu, TJ ; Gilliland, Troy ; Humes, Todd
Author_Institution :
Embedded NVM Group, Virage Logic Inc., Seattle, WA, USA
Abstract :
Logic NVM (LNVM) developed in baseline logic processes is gaining more interest from automotive applications. We discuss for the first time how to build such LNVM to achieve and assure automotive-level quality through the product development cycle. We successfully demonstrate that in-field reliability < 1 ppm may be achieved with appropriate layout and architecture selections.
Keywords :
automobile industry; digital storage; logic; product life cycle management; reliability; LNVM; automotive-level reliability; baseline logic processes; in-field reliability; logic nonvolatile memory solutions; product development cycle; Automotive applications; Automotive engineering; Costs; Design for manufacture; Logic; Nonvolatile memory; Phase change materials; Product development; Production; Testing; Logic NVM; automotive; floating-gate; qualification; reliability modeling;
Conference_Titel :
Non-Volatile Memory Technology Symposium, 2008. NVMTS 2008. 9th Annual
Conference_Location :
Pacific Grove, CA
Print_ISBN :
978-1-4244-3659-0
Electronic_ISBN :
978-1-4244-2411-5
DOI :
10.1109/NVMT.2008.4731197
