• DocumentCode
    2088024
  • Title

    Effects of gate recess depth on very high performance 0.1 mm GaAs MESFET´s

  • Author

    Moore, Karen E. ; East, Jack R. ; Haddad, George I. ; Brock, Tim

  • Author_Institution
    Center for High Frequency Microelectronics, Solid State Electronics Laboratory, The University of Michigan, Ann Arbor, MI 48109-2122. Tel: (313) 763-6132 or (313) 747-1781 (Fax)
  • fYear
    1993
  • fDate
    6-10 Sept. 1993
  • Firstpage
    99
  • Lastpage
    101
  • Abstract
    0.1 ¿m gate length conventional GaAs MESFET´s have been fabricated with a wide range of saturation currents. These devices show excellent DC and RF performance, with very little variation of device behavior with recess depth. The overall performance of these devices is competitive with the best MESFET´s demonstrated to date, with average transconductances of 578 mS/mm and average ft´s of 97 GHz. The invariance of device performance with gate recess depth demonstrates a strong advantage for GaAs MESFET´s in terms of both process latitude and device design.
  • Keywords
    Etching; Extrapolation; Gallium arsenide; Gold; Lifting equipment; MESFETs; Microelectronics; Radio frequency; Solid state circuits; Transconductance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 1993. 23rd European
  • Conference_Location
    Madrid, Spain
  • Type

    conf

  • DOI
    10.1109/EUMA.1993.336800
  • Filename
    4136538