Simple implementation of a first order advanced process control engine for thin film applications

Author

Smith, Eugene ; Raviswaran, Arvind

Author_Institution

Cypress Semicond. Minnesota Inc., Bloomington, MN, USA

fYear

2005

fDate

13-15 Sept. 2005

Firstpage

162

Lastpage

165

Abstract

PECVD of dielectric films show two major variation sources (lot-to-lot variation and device-to-device variation) that reduce the process Cpk and increase the cost of operation. To improve the PECVD process manufacturability, some form of automated compensation at runtime is necessary. This paper presents a first order APC engine that compensates for process tool deposition rate drift and pattern density differences. Both are needed to allow for a single recipe to deliver ´on target´ performance for many devices and process tools. This project improved Cpk from ∼1.0 to over 2.0.

Keywords

dielectric thin films; integrated circuit manufacture; plasma CVD; process control; PECVD; advanced process control engine; deposition rate drift; device-to-device variation; dielectric films; first order advanced process control; lot-to-lot variation; manufacturability; plasma enhanced chemical vapor deposition; process tool; thin film applications; Application software; Dielectric films; Dielectric thin films; Engines; Inductors; Manufacturing processes; Process control; Semiconductor device manufacture; Semiconductor thin films; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on

Print_ISBN

0-7803-9143-8

Type

conf

DOI

10.1109/ISSM.2005.1513324

Filename

1513324