• DocumentCode
    2090005
  • Title

    Development of a CMP pad with controlled micro features for improved performance

  • Author

    Lee, Sunghoon ; Kim, Hyoungjae ; Dornfeld, David

  • Author_Institution
    Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
  • fYear
    2005
  • fDate
    13-15 Sept. 2005
  • Firstpage
    173
  • Lastpage
    176
  • Abstract
    This paper focuses on the development of a new chemical mechanical polishing (CMP) based on characterization of conventional pads. Based on new design rules, new pads are prototyped and tested with planarity in SiO2 CMP. The result is compared with the conventional pad and the effect of each pad design is also investigated according to design rules.
  • Keywords
    chemical mechanical polishing; integrated circuit design; integrated circuit manufacture; prototypes; silicon compounds; CMP pad; SiO2; chemical mechanical polishing; pad design; pad prototyping; pad testing; Abrasives; Atherosclerosis; Chemical engineering; Fabrication; Mechanical engineering; Prototypes; Reservoirs; Shape control; Slurries; Transportation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on
  • Print_ISBN
    0-7803-9143-8
  • Type

    conf

  • DOI
    10.1109/ISSM.2005.1513327
  • Filename
    1513327
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2090005