DocumentCode :
2090265
Title :
Ear-worn reference data collection and annotation for multimodal context-aware hearing instruments
Author :
Tessendorf, B. ; Derleth, P. ; Feilner, M. ; Gravenhorst, F. ; Kettner, A. ; Roggen, D. ; Stiefmeier, T. ; Troster, G.
Author_Institution :
Wearable Comput. Lab., ETH Zurich, Zurich, Switzerland
fYear :
2012
fDate :
Aug. 28 2012-Sept. 1 2012
Firstpage :
2468
Lastpage :
2471
Abstract :
In this work we present a newly developed ear-worn sensing and annotation device to unobtrusively capture head movements in real life situations. It has been designed in the context of developing multimodal hearing instruments (HIs), but is not limited to this application domain. The ear-worn device captures triaxial acceleration, rate of turn and magnetic field and features a one-button-approach for real-time data annotation through the user. The system runtime is over 5 hours at a sampling rate of 128 Hz. In a user study with 21 participants the device was perceived as comfortable and showed a robust hold at the ear. On the example of head acceleration data we perform unsupervised clustering to demonstrate the benefit of head movements for multimodal HIs. We believe the novel technology will help to push the boundaries of HI technology.
Keywords :
acceleration; accelerometers; biomechanics; biomedical equipment; ear; hearing; hearing aids; magnetic sensors; sampling methods; ear-worn annotation device; ear-worn reference data annotation; ear-worn reference data collection; ear-worn sensing device; frequency 128 Hz; head acceleration data; head movements; magnetic field; magnetic sensors; multimodal context-aware hearing instruments; one-button-approach; real-time data annotation; sampling rate; triaxial acceleration; Acceleration; Auditory system; Ear; Instruments; Magnetic heads; Magnetic sensors; Biosensing Techniques; Equipment Design; Hearing Aids; Humans;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location :
San Diego, CA
ISSN :
1557-170X
Print_ISBN :
978-1-4244-4119-8
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2012.6346464
Filename :
6346464
Link To Document :
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