Title :
Manufacturing process for combination lead frame/TAB BGA
Author :
Mita, Mamoru ; Murakami, Gen ; Kumakura, Toyohiko ; Okabe, Norio ; Taketani, Noriaki ; Hatano, Kazuhisa ; Ohtaka, Tatsuya
Author_Institution :
Hitachi Ltd., Ibaraki, Japan
Abstract :
The Combination Lead Frame/TAB BGA has been studied to improve the manufacturability of TBGA LSI package. Ordinary lead frames and the TAB tape carriers have been applied to make the assembly of TBGA easier. The base technologies, the materials of the lead frame, and the TAB tape were thoroughly applied to the heat spreader and the fine routing flexible substrate. The lead frames as the heat spreader and the tape (manufactured by the line of the TAB tape for wire bonding substrate) are combined with a high thermal resistive adhesive (Tg473K). The solder or metal balls for the surface mounting were previously attached to the ball pads before assembling the die. With this improved Combination Lead Flame/TAB BGA, current assembly houses will never need any other new machines to produce the TBGA
Keywords :
integrated circuit packaging; large scale integration; lead bonding; surface mount technology; tape automated bonding; TBGA LSI package; Tg473K; assembly; combination lead frame/TAB BGA; heat spreader; manufacture; metal ball; solder ball; surface mounting; tape carrier; thermal resistive adhesive; wire bonding substrate; Assembly; Bonding; Fires; Large scale integration; Lead; Manufacturing processes; Packaging; Routing; Thermal resistance; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606293
