• DocumentCode
    2090399
  • Title

    Integrated yield management system using critical area analysis

  • Author

    Tsunoda, Yoshiyuki ; Kanamitsu, Kenji ; Iwata, Yoshio ; Matsumoto, Chizu ; Kamoda, Koji ; Hamamura, Yuichi ; Kojika, Fujihiko

  • Author_Institution
    Renesas Technol. Corp., Ibaraki, Japan
  • fYear
    2005
  • fDate
    13-15 Sept. 2005
  • Firstpage
    233
  • Lastpage
    236
  • Abstract
    Critical area analysis (CAA) is indispensable in yield management and enhancement. Methodology of CAA is not a new one, but the efficiency of CAA has to be still increasing. To apply CAA for all products in a high-mix, high-volume production fab, an effective workflow and integrated yield management system using CAA have been developed. The system enables circuits designers and process engineers to pick out a product in problem easily from various products in a fab using Web. It also improves the efficiency of CAA both in the case of particle condition changes and the evaluation of circuit module level yield loss by the saving of probability of fail (POF) data. Over one hundred products have been applied CAA to evaluate this system for four months. Work hours for CAA have been reduced to one twentieth of conventional method by applying this system.
  • Keywords
    design for manufacture; electronic engineering computing; integrated circuit design; integrated circuit yield; production engineering computing; production management; statistical analysis; World Wide Web; circuit module level yield loss; circuits designers; critical area analysis; fail probability; integrated yield management system; particle condition; process engineers; production fab; workflow management system; yield enhancement; Computer aided analysis; Data mining; Design engineering; Design for manufacture; Integrated circuit yield; Manufacturing; Process design; Production systems; Productivity; Technology management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on
  • Print_ISBN
    0-7803-9143-8
  • Type

    conf

  • DOI
    10.1109/ISSM.2005.1513344
  • Filename
    1513344