• DocumentCode
    2090402
  • Title

    A Parallel 3-D impedance method to compute the Induce Current in Human Head by TMS

  • Author

    Yu-Nan, Han ; Ying-Hua, Lu ; Jin-Ling, Zhang ; Hong-xin, Zhang

  • Author_Institution
    Beijing Univ. of Posts & Telecommun., Beijing
  • fYear
    2007
  • fDate
    23-27 May 2007
  • Firstpage
    1430
  • Lastpage
    1434
  • Abstract
    The induced current density distribution in human head model caused by transcranial magnetic stimulation (TMS) is simulated based on the parallel 3-dimenstional impedance method. The magnetic field from a typical TMS coil which is placed at the surface of human head, for present the clinically of depression treatment, is calculated by Biot-Savart law. The parallel 3-D method is implemented on an 8-CPU computer cluster. The distribution of induced current density is simulated and the results show the higher conductivity tissues such as blood, cerebral spinal fluid, muscle, and ligament have higher currents in the skull. The maximum induced current density in the head model is 180 A/m2 corresponding to the magnitude 10000 A for rTMS protocol. The results show biological interesting for further TMS study.
  • Keywords
    bioelectric phenomena; biomagnetism; blood; brain models; electromagnetism; medical computing; muscle; neurophysiology; patient treatment; 8-CPU computer cluster; Biot-Savart law; TMS coil; blood; brain stimulation; cerebral spinal fluid; electrical conductivity; human head model; induced current density; ligament; magnetic field depression treatment; muscle; parallel 3-D impedance method; skull; tissues; transcranial magnetic stimulation; Coils; Computational modeling; Concurrent computing; Current density; Humans; Impedance measurement; Magnetic fields; Magnetic heads; Magnetic stimulation; Surface treatment; impedance method (IM); induce current density; transcranial magnetic stimulation (TMS); visible human project;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Complex Medical Engineering, 2007. CME 2007. IEEE/ICME International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-1077-4
  • Electronic_ISBN
    978-1-4244-1078-1
  • Type

    conf

  • DOI
    10.1109/ICCME.2007.4381981
  • Filename
    4381981