Title :
Scrubber-induced substrate cracks found by data mining analysis
Author :
Hirano, Yori ; Shindo, Wataru ; Ono, Ryota ; Kitou, Mitsuru ; Yamaura, Takamichi ; Satou, Fumio ; Imaoka, Kazunori
Author_Institution :
Spansion Japan Limited, Fukushima, Japan
Abstract :
In order to improve the yield enhancement speed, we adopt data mining analysis. The root cause of crack in silicon substrate induced by scrubber tool was found by data mining approach. It could not be detected by conventional knowledge-based pre-filtering approach. As a countermeasure, we switched the scrubber from high pressure clean tool to moderate pressure clean tool.
Keywords :
crystal defects; data mining; elemental semiconductors; integrated circuit yield; production engineering computing; silicon; statistical analysis; surface cleaning; surface cracks; Si; data mining analysis; high pressure clean tool; knowledge-based pre-filtering approach; scrubber tool; silicon substrate; substrate crack; yield enhancement speed; Data analysis; Data engineering; Data mining; Failure analysis; Filters; Flash memory cells; Knowledge engineering; Manufacturing; Signal analysis; Silicon;
Conference_Titel :
Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on
Print_ISBN :
0-7803-9143-8
DOI :
10.1109/ISSM.2005.1513350
