Title :
Process check time reduction by the application of an in-line thin film thickness measurement tool
Author :
Murata, Kiyoshi ; Saeki, Kenichi
Author_Institution :
NEC Fabserve Ltd., Kanagawa
Abstract :
Efficient improvement of productivity is required for the semiconductor fabrication line. It is very effective to reduce the PC(process check) time for efficiency improvement of productivity. To reduce PC time, we evaluated the in-line thin film thickness measurement tool. The result of the application of the in-line thin film thickness measurement tool, we succeeded to reduce RESIST and BARC film thickness inspection time dramatically as compared with the conventional film thickness inspection time, and proved that the investment efficiency of RESIST and BARC film thickness control was improved
Keywords :
inspection; integrated circuit manufacture; integrated circuit measurement; productivity; thickness control; thickness measurement; thin films; BARC film thickness; RESIST film thickness; inspection time; process check time; process check time reduction; productivity improvement; semiconductor fabrication line; thin film thickness measurement; Dispersion; Fabrication; Inspection; Productivity; Resists; Semiconductor films; Semiconductor thin films; Stability; Thickness measurement; Transistors;
Conference_Titel :
Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9143-8
DOI :
10.1109/ISSM.2005.1513362
