Title :
New composite organic dielectric for high performance flip chip single chip packages
Author :
Korleski, Joseph E. ; Gorrell, Robin E. ; Bowen, Christopher P. ; Noddin, David B.
Author_Institution :
Electron. Packaging & Mater. Div., W.L. Gore & Assoc., Elkton, MD, USA
Abstract :
A new composite organic dielectric has been developed which allows the production of reliable high performance single chip packages using modified printed circuit board construction techniques. The tailored coefficient of thermal expansion (CTE), dimensional stability, low dielectric constant, high glass transition temperature and thin nature of the new dielectric are well suited to the requirements of flip chip packaging. The properties and processing of the new dielectric will be reviewed and results of reliability testing will be offered in this presentation
Keywords :
composite materials; dielectric materials; flip-chip devices; organic compounds; packaging; coefficient of thermal expansion; composite organic dielectric; dielectric constant; dimensional stability; flip chip single chip package; glass transition temperature; printed circuit board construction; reliability; Circuit stability; Flip chip; Glass; High-K gate dielectrics; Packaging; Printed circuits; Production; Temperature; Thermal expansion; Thermal stability;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606295
