Title :
High-Performance TSV Architecture for 3-D ICs
Author :
Daneshtalab, Masoud ; Ebrahimi, Masoumeh ; Liljeberg, Pasi ; Plosila, Juha ; Tenhunen, Hannu
Author_Institution :
Dept. of Inf. Technol., Univ. of Turku, Turku, Finland
Abstract :
Three-dimensional integrated circuits (3-D ICs) outperform traditional planar ICs in terms of performance, packaging density, interconnection power consumption, and functionality. Since the performance of 3-D ICs employing Through Silicon Vias (TSVs) depends on vertical interlayer interconnects, in this paper we present a high-performance bus architecture for TSVs.
Keywords :
integrated circuit interconnections; three-dimensional integrated circuits; 3D IC; high-performance TSV architecture; high-performance bus architecture; three-dimensional integrated circuit; through-silicon-via technology; vertical interlayer interconnects; Computer architecture; Integrated circuit interconnections; Pipeline processing; Synchronization; System-on-a-chip; Three dimensional displays; Topology; Three-dimensional integrated circuits; Through Silicon Vias; pipelined bus;
Conference_Titel :
VLSI (ISVLSI), 2010 IEEE Computer Society Annual Symposium on
Conference_Location :
Lixouri, Kefalonia
Print_ISBN :
978-1-4244-7321-2
DOI :
10.1109/ISVLSI.2010.24
