DocumentCode :
2091314
Title :
Pattern of vertical engineering collaboration between foundry and design service provider
Author :
Su, Yea-Huey ; Guo, Ruey-Shan ; Hsiao, Chia-Hsien
Author_Institution :
Dept. of Inf. Manage., Nat. Central Univ., Chung-li
fYear :
2005
fDate :
13-15 Sept. 2005
Firstpage :
361
Lastpage :
364
Abstract :
As IC design and manufacturing complexities continue to increase exponentially, it is becoming less practical for a single company to provide products and services without collaborated partners. The goal of this research is then to explore how foundries and design service providers collaborate with each other under the new business paradigm. By conducting field interviews and empirical study on six collaboration cases, this research proposes four different collaboration patterns, which are: complementary-equity collaboration pattern, agent-equity collaboration pattern, complementary-nonequity collaboration pattern, and agent-nonequity collaboration pattern. There are several findings: 1) when both parties have stronger complementary assets relationship, the transaction cost is lower and the relationship is more stable; 2) long-term partnership and timing governance mechanism reduce negotiation effort and facilitate quick time-to-market; 3) closer collaboration process can significantly reduce the errors in design project
Keywords :
foundries; groupware; integrated circuit design; integrated circuit manufacture; production engineering computing; software agents; time to market; IC design; agent-equity collaboration pattern; agent-nonequity collaboration pattern; complementary assets relationship; complementary-equity collaboration pattern; complementary-nonequity collaboration pattern; design service provider; foundry; long-term partnership; manufacturing complexities; time-to-market; timing governance mechanism; transaction cost; vertical engineering collaboration; Collaboration; Companies; Costs; Design engineering; Electronics industry; Foundries; Information management; Manufacturing; Time to market; Timing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9143-8
Type :
conf
DOI :
10.1109/ISSM.2005.1513378
Filename :
1513378
Link To Document :
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