DocumentCode
2092442
Title
Effects of polymer die attach-leadframe interface integrity on thermal performance of power semiconductor packages
Author
Chuang, Shih-Fang ; Kee, David R.
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
fYear
1997
fDate
18-21 May 1997
Firstpage
1061
Lastpage
1067
Abstract
In this paper, we investigate the effects of integrity at die-attach/leadframe interface on the thermal resistances of packages. Factors that impact the interface integrity such as leadframe surface finishes, die attach types and thermomechanical stress are addressed. Our goal is to achieve the best thermal performance of power semiconductor packages with optimal conditions
Keywords
microassembling; polymers; power semiconductor devices; semiconductor device packaging; thermal resistance; polymer die attach-leadframe interface integrity; power semiconductor package; surface finish; thermal performance; thermal resistance; thermomechanical stress; Adhesives; Conducting materials; Copper; Lead; Microassembly; Polymers; Semiconductor device packaging; Semiconductor materials; Thermal conductivity; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location
San Jose, CA
ISSN
0569-5503
Print_ISBN
0-7803-3857-X
Type
conf
DOI
10.1109/ECTC.1997.606301
Filename
606301
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