Title :
Automatic Measurement System for degradation analysis in thin-film AlCu metallizations
Author :
Catelani, M. ; Nicoletti, R.
Author_Institution :
Dept. of Electron. & Telecommun., Florence Univ., Italy
Abstract :
In this work a thermal test on multilayered integrated thin-film AlCu resistive structures is performed in order to study physical degradation phenomena involved in thermal treatment of metallization. A complete Automatic Measurement System is designed and realized to acquire resistive and temperature values during all the testing time with the aim to check the degradation process and the reliability performances of the structures under test. The thermostatic oven used for the thermal ageing has been characterized to guarantee specific temperature uniformity and stability
Keywords :
aluminium; automatic test equipment; copper; heat treatment; integrated circuit metallisation; integrated circuit testing; multilayers; thermal stability; thermal stresses; thin film resistors; AlCu; AlCu metallization; Automatic Measurement System; degradation analysis; integrated thin-film; multilayered integrated resistive structure; physical degradation; reliability; temperature uniformity; temperature uniformity and stability; thermal ageing; thermal treatment; thermostatic oven; Automatic testing; Metallization; Ovens; Performance evaluation; System testing; Temperature; Thermal degradation; Thermal resistance; Time measurement; Transistors;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 2000. IMTC 2000. Proceedings of the 17th IEEE
Conference_Location :
Baltimore, MD
Print_ISBN :
0-7803-5890-2
DOI :
10.1109/IMTC.2000.848736
