Wafer-Level Fabrication of a Fused-Quartz Double-Ended Tuning Fork Resonator Oscillator Using Quartz-on-Quartz Direct Bonding

Author

Eun-Seok Song ; Sungmuk Kang ; Hoseong Kim ; Yong-Kweon Kim ; Jun-Eon An ; Chang-Wook Baek

Author_Institution

Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea

Volume

34

Issue

5

fYear

2013

fDate

May-13

Firstpage

692

Lastpage

694

Abstract

In this letter, a novel process to fabricate high-Q fused-quartz micromechanical resonators is demonstrated. Plasma-assisted quartz-on-quartz direct bonding at a low temperature in combination with quartz deep-reactive ion etching technique enables a simple wafer-level fabrication of self-mounted, electrostatically driven fused-quartz resonators. A 27-kHz capacitively transduced double-ended tuning fork fused-quartz resonator oscillator is successfully fabricated using the developed process. A high resonator Q-factor of 68000 is obtained, and the constructed oscillator shows a signal-to-noise ratio of 70 dB.

Keywords

bonding processes; crystal resonators; micromechanical resonators; oscillators; plasma materials processing; sputter etching; vibrations; capacitively transduced double-ended tuning fork fused-quartz resonator oscillator; electrostatically driven fused-quartz resonators; frequency 27 kHz; fused-quartz double-ended tuning fork resonator oscillator; high resonator Q-factor; high-Q fused-quartz micromechanical resonators; plasma-assisted quartz-on-quartz direct bonding; quartz deep-reactive ion etching technique; self-mounted fused-quartz resonators; signal-to-noise ratio; wafer-level fabrication; double-ended tuning fork (DETF) resonator; fused quartz; micromechanical resonator oscillator; quartz-on-quartz bonding;

fLanguage

English

Journal_Title

Electron Device Letters, IEEE

Publisher

ieee

ISSN

0741-3106

Type

jour

DOI

10.1109/LED.2013.2253753

Filename

6502191