DocumentCode :
20929
Title :
Wafer-Level Fabrication of a Fused-Quartz Double-Ended Tuning Fork Resonator Oscillator Using Quartz-on-Quartz Direct Bonding
Author :
Eun-Seok Song ; Sungmuk Kang ; Hoseong Kim ; Yong-Kweon Kim ; Jun-Eon An ; Chang-Wook Baek
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
Volume :
34
Issue :
5
fYear :
2013
fDate :
May-13
Firstpage :
692
Lastpage :
694
Abstract :
In this letter, a novel process to fabricate high-Q fused-quartz micromechanical resonators is demonstrated. Plasma-assisted quartz-on-quartz direct bonding at a low temperature in combination with quartz deep-reactive ion etching technique enables a simple wafer-level fabrication of self-mounted, electrostatically driven fused-quartz resonators. A 27-kHz capacitively transduced double-ended tuning fork fused-quartz resonator oscillator is successfully fabricated using the developed process. A high resonator Q-factor of 68000 is obtained, and the constructed oscillator shows a signal-to-noise ratio of 70 dB.
Keywords :
bonding processes; crystal resonators; micromechanical resonators; oscillators; plasma materials processing; sputter etching; vibrations; capacitively transduced double-ended tuning fork fused-quartz resonator oscillator; electrostatically driven fused-quartz resonators; frequency 27 kHz; fused-quartz double-ended tuning fork resonator oscillator; high resonator Q-factor; high-Q fused-quartz micromechanical resonators; plasma-assisted quartz-on-quartz direct bonding; quartz deep-reactive ion etching technique; self-mounted fused-quartz resonators; signal-to-noise ratio; wafer-level fabrication; double-ended tuning fork (DETF) resonator; fused quartz; micromechanical resonator oscillator; quartz-on-quartz bonding;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2013.2253753
Filename :
6502191
Link To Document :
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