• DocumentCode
    2092918
  • Title

    Temperature distribution analysis of /spl lambda//4 type EM-absorber using resistive film

  • Author

    Watanabe, Shinya ; Iino, Kazuya ; Saito, Kota ; Hashimoto, Osamu

  • Author_Institution
    Dept. of Electr. Eng. & Electron., Aoyama Gakuin Univ., Tokyo
  • Volume
    1
  • fYear
    2005
  • fDate
    12-12 Aug. 2005
  • Firstpage
    64
  • Lastpage
    68
  • Abstract
    This paper describes the temperature distribution analysis of lambda/4 type EM-absorber using resistive film when high electric power is injected to the absorber. For the temperature analysis, FDTD method is used to analyze electromagnetics and SIMPLE (semi-implicit method for pressure linked equations) method is used for calculation of heat transport and air convection enabling to analyze local heat transfer more strictly than heat transport equation (HTE) method which is the traditional heat transport analysis method. And we propose four types of wave absorbers to analyze these temperature distribution on the resistive film to find the best type with least temperature rise. As a result, when glass and metal plates are used for spacer and reflector, respectively, the absorber proved to be the best one from a view point of temperature descent. And it is shown that the temperature range does not cause the change of absorbing characteristics in the analysis but the temperature rise exceeds 160 degC, the characteristics may change
  • Keywords
    electromagnetic wave absorption; films; finite difference time-domain analysis; heat transfer; temperature distribution; FDTD method; air convection; electromagnetics; glass; heat transport; heat transport equation method; lambda/4 type EM-absorber; metal plates; resistive film; semiimplicit method for pressure linked equations method; temperature distribution analysis; Electromagnetic analysis; Electromagnetic heating; Electromagnetic wave absorption; Equations; Finite difference methods; Heat transfer; Power generation; Temperature distribution; Temperature measurement; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2005. EMC 2005. 2005 International Symposium on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-9380-5
  • Type

    conf

  • DOI
    10.1109/ISEMC.2005.1513473
  • Filename
    1513473