• DocumentCode
    2093295
  • Title

    An overview of computer packaging architecture and electrical design

  • Author

    Chang, Chi

  • Author_Institution
    IBM, Endicott, NY, USA
  • fYear
    1990
  • fDate
    32988
  • Firstpage
    239
  • Lastpage
    257
  • Abstract
    A discussion of packaging architecture is presented to understand the requirement on the physical design of the single chip module (SCM), multichip module (MCM), printed circuit board (PCB), connector, and cable. They in turn establish the driving force for their electrical designs. The packaging architecture of midrange, mainframe, and workstation computer systems provides an insight into the requirements of the physical and electrical design of electronic packaging of the future. It is important to ensure the electrical signal fidelity throughout the interconnection to limit the switching noise and signal crosstalk, and to minimize the propagation delay due to packaging. Electrical design with these consideration for chip carrier, printed circuit boards, connector, and cables is described
  • Keywords
    cables (electric); digital computers; electric connectors; integrated circuit technology; modules; packaging; printed circuit accessories; printed circuit design; PCB; cable; chip carrier; computer electrical design; computer packaging architecture; connector; electrical signal fidelity; electronic packaging; mainframe; multichip module; printed circuit board; propagation delay; signal crosstalk; single chip module; switching noise; workstation computer; Circuit noise; Computer architecture; Connectors; Crosstalk; Electronics packaging; Integrated circuit interconnections; Multichip modules; Physics computing; Printed circuits; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Southern Tier Technical Conference, 1990., Proceedings of the 1990 IEEE
  • Conference_Location
    Binghamton, NY
  • Type

    conf

  • DOI
    10.1109/STIER.1990.324651
  • Filename
    324651