DocumentCode
2093295
Title
An overview of computer packaging architecture and electrical design
Author
Chang, Chi
Author_Institution
IBM, Endicott, NY, USA
fYear
1990
fDate
32988
Firstpage
239
Lastpage
257
Abstract
A discussion of packaging architecture is presented to understand the requirement on the physical design of the single chip module (SCM), multichip module (MCM), printed circuit board (PCB), connector, and cable. They in turn establish the driving force for their electrical designs. The packaging architecture of midrange, mainframe, and workstation computer systems provides an insight into the requirements of the physical and electrical design of electronic packaging of the future. It is important to ensure the electrical signal fidelity throughout the interconnection to limit the switching noise and signal crosstalk, and to minimize the propagation delay due to packaging. Electrical design with these consideration for chip carrier, printed circuit boards, connector, and cables is described
Keywords
cables (electric); digital computers; electric connectors; integrated circuit technology; modules; packaging; printed circuit accessories; printed circuit design; PCB; cable; chip carrier; computer electrical design; computer packaging architecture; connector; electrical signal fidelity; electronic packaging; mainframe; multichip module; printed circuit board; propagation delay; signal crosstalk; single chip module; switching noise; workstation computer; Circuit noise; Computer architecture; Connectors; Crosstalk; Electronics packaging; Integrated circuit interconnections; Multichip modules; Physics computing; Printed circuits; Workstations;
fLanguage
English
Publisher
ieee
Conference_Titel
Southern Tier Technical Conference, 1990., Proceedings of the 1990 IEEE
Conference_Location
Binghamton, NY
Type
conf
DOI
10.1109/STIER.1990.324651
Filename
324651
Link To Document