Title :
Packaging technology for wavelength tunable filter based on optical MEMS
Author :
Eom, Yong-Sung ; Lee, Jong-Hyun ; Choi, Byung-Suk ; Kim, Jong-Deog ; Yun, Ho-Gyeong ; Choi, Kwang-Seong ; Moon, Jong-Tae ; Lee, Myung-Lae ; Choi, Chang-Auck ; Jun, Chi-Hoon
Author_Institution :
Basic Res. Lab., Electron. & Telecommun. Res. Inst., Daejeon, South Korea
Abstract :
One of the key components for the WDM optical communication is a wavelength tunable filter. The packaging technology of the tunable filter with Fabry-Perot cavity based on optical MEMS is investigated for the low power consumption and mass production. The flip chip process with Au-20(wt.%)Sn solder was conducted to integrate two DBR mirrors in parallel with a constant distance for the simple design of packaging structure. TEC fiber was used to achieve a wide range of the optical alignment tolerance for the high coupling efficiency.
Keywords :
Fabry-Perot resonators; distributed Bragg reflectors; integrated circuit packaging; integrated optics; micro-optics; micromechanical devices; optical communication equipment; optical fibre couplers; optical filters; optical tuning; packaging; wavelength division multiplexing; Au-Sn solder; AuSn; DBR mirrors; Fabry-Perot cavity; TEC fiber; WDM optical communication; flip chip process; low power consumption; optical MEMS; packaging technology; wavelength tunable filter; Energy consumption; Fabry-Perot; Flip chip; Mass production; Micromechanical devices; Optical fiber communication; Optical fiber filters; Optical filters; Packaging; Wavelength division multiplexing;
Conference_Titel :
Optical MEMS, 2003 IEEE/LEOS International Conference on
Print_ISBN :
0-7803-7830-X
DOI :
10.1109/OMEMS.2003.1233470
