A software based on simple, fast, correct formulae for modeling the propagation characteristics of HTSC transmission lines at microwaves

Author

Kaparkov, D. ; Chenko, S. Gal ; Kolesov, S. ; Kuznetsov, V. ; Popov, A. ; Vendik, O.

Author_Institution

Chalmers University of technology, Gothenburg, S-41 296, Sweden; St.-Petersburg Electrotechnical University, St.-Petersburq, 197376, Russia. Tel: +(46)-31 772 18 53; Fax +(46)-31 1645 13; E-mail: kollberg@ep.chslmers.se

fYear

1993

fDate

6-10 Sept. 1993

Firstpage

725

Lastpage

727

Abstract

The goal of this paper is to develop the model notions which could be used as a basis for carrying out a CAD system for the MICs on HTSC films. The calculations is based on the numerical data describing the surface resistance of the film at the given frequency and temperature and the current distribution across the conductors of the transmission line. A phenomenological model of the HTSC is used. The current distributions are obtained from magnetostatic approximation which is suitable for the HTSC films up to the frequency about 300GHz. A minimum of the numerical parameters is necessary to describe the properties of the HTSC material. A software which makes it possible to calculate the parameters of transmission lines based on the HTSC films as a function of frequency and temperature is developed. The simulation can be carried out for microstrip or for coplanar lines.

Keywords

Conducting materials; Conductive films; Current distribution; Frequency; Magnetostatics; Microwave integrated circuits; Microwave propagation; Surface resistance; Temperature distribution; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 1993. 23rd European

Conference_Location

Madrid, Spain

Type

conf

DOI

10.1109/EUMA.1993.336685

Filename

4136746