Title :
MEMS packaging using precision machined LTCC substrates
Author :
Heikkinen, Veli ; Aikio, Janne ; Alajoki, Teemu ; Hiltunen, Jussi ; Matilla, A.-J. ; Ollila, Jyrki ; Karioja, Pentti
Author_Institution :
VTT Electron. & Infotech, Oulu, Finland
Abstract :
The use of low-temperature co-fired ceramic (LTCC) substrate as a wiring board for a silicon surface micromachined Fabry-Perot interferometer (FPI) device is presented. FPI is an electrically controlled optical bandpass filter that is widely used in spectroscopy. In this paper, the FPI device is applied to demonstrate a wavelength tunable diode laser in an external cavity configuration.
Keywords :
Fabry-Perot interferometers; band-pass filters; elemental semiconductors; integrated circuit packaging; laser cavity resonators; laser tuning; micromachining; micromechanical devices; optical filters; semiconductor lasers; silicon; substrates; LTCC substrates; MEMS packaging; Si; external cavity configuration; low-temperature co-fired ceramic substrates; micromachined Fabry-Perot interferometer; precision machining; silicon surface Fabry-Perot interferometer; wavelength tunable diode laser; Ceramics; Fabry-Perot interferometers; Micromechanical devices; Optical control; Optical filters; Optical interferometry; Optical surface waves; Packaging machines; Silicon; Wiring;
Conference_Titel :
Optical MEMS, 2003 IEEE/LEOS International Conference on
Print_ISBN :
0-7803-7830-X
DOI :
10.1109/OMEMS.2003.1233477
