MEMS packaging using precision machined LTCC substrates

Author

Heikkinen, Veli ; Aikio, Janne ; Alajoki, Teemu ; Hiltunen, Jussi ; Matilla, A.-J. ; Ollila, Jyrki ; Karioja, Pentti

Author_Institution

VTT Electron. & Infotech, Oulu, Finland

fYear

2003

fDate

18-21 Aug. 2003

Firstpage

81

Lastpage

82

Abstract

The use of low-temperature co-fired ceramic (LTCC) substrate as a wiring board for a silicon surface micromachined Fabry-Perot interferometer (FPI) device is presented. FPI is an electrically controlled optical bandpass filter that is widely used in spectroscopy. In this paper, the FPI device is applied to demonstrate a wavelength tunable diode laser in an external cavity configuration.

Keywords

Fabry-Perot interferometers; band-pass filters; elemental semiconductors; integrated circuit packaging; laser cavity resonators; laser tuning; micromachining; micromechanical devices; optical filters; semiconductor lasers; silicon; substrates; LTCC substrates; MEMS packaging; Si; external cavity configuration; low-temperature co-fired ceramic substrates; micromachined Fabry-Perot interferometer; precision machining; silicon surface Fabry-Perot interferometer; wavelength tunable diode laser; Ceramics; Fabry-Perot interferometers; Micromechanical devices; Optical control; Optical filters; Optical interferometry; Optical surface waves; Packaging machines; Silicon; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical MEMS, 2003 IEEE/LEOS International Conference on

Print_ISBN

0-7803-7830-X

Type

conf

DOI

10.1109/OMEMS.2003.1233477

Filename

1233477