Title :
Fabrication of optical MEMS switches having multilevel mirror-drive electrodes
Author :
Ishii, H. ; Tanabe, Y. ; Shimamura, T. ; Yamaguchi, J. ; Urano, M. ; Kamei, T. ; Kudou, K. ; Yano, M. ; Uenishi, Y. ; Machida, K.
Author_Institution :
NTT Microsystem Integration Labs., NTT Corp., Kanagawa, Japan
Abstract :
The aim of this work is to show the effective way for the formation of optical MEMS switches by applying seamless integration technology (SeaiT) as a first step toward LSI integration. The fabrication process of the optical MEMS switches in this work consisted of electrode fabrication, mirror fabrication, and packaging. A 6-inch-diameter bulk-Si and SOI wafers are used for the fabrication of electrodes and mirrors, respectively.
Keywords :
electrodes; elemental semiconductors; integrated optics; micromirrors; microswitches; optical fabrication; optical switches; packaging; silicon; silicon-on-insulator; 6 inch; LSI integration; SOI wafer; Si; bulk-Si wafer; electrode fabrication; mirror fabrication; multilevel mirror-drive electrodes; optical MEMS switches; packaging; seamless integration technology; Coatings; Electrodes; Integrated optics; Microswitches; Mirrors; Optical device fabrication; Optical sensors; Packaging; Polyimides; Protection;
Conference_Titel :
Optical MEMS, 2003 IEEE/LEOS International Conference on
Print_ISBN :
0-7803-7830-X
DOI :
10.1109/OMEMS.2003.1233496
