Title : 
Automatic netlist extraction for measurement-based characterization of off-chip interconnect
         
        
            Author : 
Corey, S.D. ; Yang, A.T.
         
        
            Author_Institution : 
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
         
        
        
        
        
        
            Abstract : 
An approach is presented for modeling board level, package-level, and MCM substrate-level interconnect circuitry based an measured time domain refectometry data. The time-domain scattering parameters of a multiport system are used to extract a SPICE netlist which uses standard elements to match the behavior of the device up to a user-specified cutoff frequency. Linear or nonlinear circuits may be connected to the model ports, and the entire circuit simulated in a standard circuit simulator. Two-port and four-port example microstrip circuits are characterized, and the simulation results are compared with measured data. Delay, reflection transmission, and crosstalk are accurately modeled in each case.
         
        
            Keywords : 
SPICE; circuit analysis computing; delays; linear network analysis; microstrip circuits; multichip modules; nonlinear network analysis; time-domain reflectometry; MCM substrate-level interconnect circuitry; SPICE netlist; automatic netlist extraction; circuit simulator; crosstalk; delay; linear circuits; measured time domain refectometry data; measurement-based characterization; microstrip circuits; multichip modules; multiport system; nonlinear circuits; off-chip interconnect; reflection transmission; time-domain scattering parameters; user-specified cutoff frequency; Circuit simulation; Cutoff frequency; Data mining; Integrated circuit interconnections; Nonlinear circuits; Packaging; SPICE; Scattering parameters; Time domain analysis; Time measurement;
         
        
        
        
            Conference_Titel : 
Computer-Aided Design, 1996. ICCAD-96. Digest of Technical Papers., 1996 IEEE/ACM International Conference on
         
        
            Conference_Location : 
San Jose, CA, USA
         
        
            Print_ISBN : 
0-8186-7597-7
         
        
        
            DOI : 
10.1109/ICCAD.1996.568905