DocumentCode :
2094946
Title :
Comparison of thick-and thin-film technology using wafer probes
Author :
Tellex, J Rodriguez
Author_Institution :
Department of Electronic & Electrical Engineering, University of Bradford, BRADFORD, West Yorkshire, BD7 1DP, UK. TEL.: +44 274 384008; FAX: +44 274 391521
fYear :
1993
fDate :
6-10 Sept. 1993
Firstpage :
863
Lastpage :
865
Abstract :
In this paper, a newly-designed thick-film low-cost probe for on-wafer S-parameter measurements is described and compared with a thin-film version. Test results show that the thick-film probe compares well with the thin-film version and that it can be used in measurements at up to 18GHz with little loss in performance. In addition to describing the thick-film probe, this paper describes the materials and fabrication aspects which influence high-frequency thick-film behaviour.
Keywords :
Conducting materials; Conductivity; Conductors; Glass; Gold; Probes; Strips; Substrates; Testing; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 1993. 23rd European
Conference_Location :
Madrid, Spain
Type :
conf
DOI :
10.1109/EUMA.1993.336731
Filename :
4136792
Link To Document :
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