Title :
IC wire bond inspection using elliptical model approximation
Author :
Ngan, King N. ; Kang, Sing B.
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
Abstract :
An algorithm that has been developed to inspect the integrity of wire bonds on an IC die is described. The algorithm uses of an elliptical model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. Missing bonds and double bonds can also be detected
Keywords :
computer vision; inspection; integrated circuit manufacture; lead bonding; IC wire bond inspection; aberrations; computer vision; computerised picture processing; elliptical model approximation; Approximation algorithms; Assembly; Bonding processes; Humans; Image edge detection; Inspection; Integrated circuit modeling; Pixel; Shape; Wire;
Conference_Titel :
Robotics and Automation, 1988. Proceedings., 1988 IEEE International Conference on
Conference_Location :
Philadelphia, PA
Print_ISBN :
0-8186-0852-8
DOI :
10.1109/ROBOT.1988.12336
