Title :
2003 IEEE International Conference on Simulation of Semiconductor Processes and Devices (Cat. No.03TH8679)
Abstract :
The following topics are dealt with: interconnect and back end; mobility and transport models; fluctuations; numerics for process/device modeling; high field device transport; front end process physics; quantum effects and TCAD applications; heterojunction device physics; compact models.
Keywords :
carrier mobility; circuit simulation; fluctuations; high field effects; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; semiconductor device models; semiconductor device noise; semiconductor heterojunctions; semiconductor process modelling; technology CAD (electronics); IC back end processing; IC interconnects; TCAD applications; carrier mobility; carrier transport; compact models; device modeling; fluctuations; front end process physics; heterojunction device physics; high field device transport; process modeling; quantum effects; semiconductor device simulation; semiconductor process simulation;
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. International Conference on
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7826-1
DOI :
10.1109/SISPAD.2003.1233621
