DocumentCode :
2095905
Title :
Simulation of number of pulses to breakdown during TLP for ESD testing
Author :
Matsuzawa, Kazuya ; Satake, Hideki ; Sutou, Chie ; Kawashima, Hirobumi
Author_Institution :
Adv. LSI Technol. Lab., Toshiba Corp., Yokohama, Japan
fYear :
2003
fDate :
3-5 Sept. 2003
Firstpage :
129
Lastpage :
132
Abstract :
The breakdown characteristics of the gate insulator of nMOSFETs during transmission line pulsing for electrostatic discharge testing is evaluated by using device simulations. Experimental data for the gate bias and gate oxide thickness dependences of the number of pulses to breakdown are reproduced by adopting the anode-hole-injection model. The polarity of the gate bias dependence of the breakdown characteristics can be explained by the depletion of the gate electrode.
Keywords :
MOSFET; electrostatic discharge; semiconductor device models; semiconductor device reliability; MOSFET; anode-hole-injection model; breakdown characteristics; device simulations; electrostatic discharge testing; gate bias; gate insulator; gate oxide thickness; transmission line pulsing; Charge carrier processes; Circuit simulation; Current density; Electric breakdown; Electrostatic discharge; Impact ionization; Insulation; Insulator testing; Semiconductor device testing; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. International Conference on
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7826-1
Type :
conf
DOI :
10.1109/SISPAD.2003.1233654
Filename :
1233654
Link To Document :
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