• DocumentCode
    2095911
  • Title

    A hybrid MoM-SPICE technique for field coupling analysis of transmission lines in presence of complex structures

  • Author

    Bayram, Yakup ; Volakis, John L.

  • Author_Institution
    Dept. of ECE, Ohio State Univ., Columbus, OH
  • Volume
    2
  • fYear
    2005
  • fDate
    12-12 Aug. 2005
  • Firstpage
    590
  • Lastpage
    595
  • Abstract
    A computationally efficient method for field coupling on multiconductor transmission lines near complex structures is proposed. Key to the method is the decomposition of the current on each transmission line into push-push and push-pull mode currents. The former accounts for the interactions between the transmission line bundle and the surrounding structure, whereas the latter corresponds current perturbation to account for interactions among the transmission lines within the bundle. The push-pull mode current is computed via the traditional transmission line approach by taking one of the wires in the bundle as the return/reference conductor. On the other hand, the push-push mode current is found by solving a test wire located along the reference transmission line in the presence of the surrounding structure. For this analysis, the surrounding structure is modeled via the method of moments and SPICE-like simulator is used to simulate an equivalent coupling circuit model of the transmission lines extracted via the partial element equivalent circuit (PEEC) method
  • Keywords
    SPICE; coupled circuits; equivalent circuits; method of moments; multiconductor transmission lines; transmission line theory; equivalent coupling circuit model; field coupling analysis; hybrid MoM-SPICE technique; method of moments; multiconductor transmission lines; partial element equivalent circuit method; push-pull mode currents; push-push currents; Analytical models; Circuit simulation; Circuit testing; Conductors; Couplings; Distributed parameter circuits; Moment methods; Multiconductor transmission lines; Transmission lines; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2005. EMC 2005. 2005 International Symposium on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-9380-5
  • Type

    conf

  • DOI
    10.1109/ISEMC.2005.1513583
  • Filename
    1513583