Determination of high frequency package currents from near-field scan data

Integrated circuits (ICs) are often a significant source of radiated energy from electronic systems. Near-field magnetic scanning is an effective tool for measuring the current distribution in IC packages and investigating chip-level EMI problems. This paper discusses analysis of near-magnetic field scan data using tangential and normal field measurements. Results show that combining near-field scan results from probes with multiple orientations is an effective way to identify the current paths in IC packages.