DocumentCode :
20965
Title :
Thermal Quench Behaviors of No-Insulation Coils Wound Using GdBCO Coated Conductor Tapes With Various Lamination Materials
Author :
Yoon Hyuck Choi ; Oh Jun Kwon ; Young-Gyun Kim ; Jung-Bin Song ; Ji Hyung Kim ; Ho-Min Kim ; Haigun Lee
Author_Institution :
Dept. of Mater. Sci. & Eng., Korea Univ., Seoul, South Korea
Volume :
24
Issue :
3
fYear :
2014
fDate :
Jun-14
Firstpage :
1
Lastpage :
5
Abstract :
This paper presents the quench initiation and propagation characteristics of no-insulation racetrack coils wound using three types of Cu-stabilized GdBCO coated conductors (CCs), with SUS and brass laminations, and without lamination. The test results show that the minimum quench energy values of the brass-laminated GdBCO CC coil were larger than those of the SUS-laminated one. Moreover, the normal zone propagation velocities of the brass-laminated GdBCO CC coil were greater than those of the SUS-laminated one due to the higher thermal conductivity of brass. Moreover, the nonlaminated GdBCO CC coil exhibited greatly improved thermal stability compared to the brass/SUS-laminated GdBCO CC coils, because the local heat in the event of quenching was easily dissipated due to the absence of lamination.
Keywords :
barium compounds; gadolinium compounds; high-temperature superconductors; laminations; quenching (thermal); superconducting coils; superconducting tapes; thermal conductivity; thermal stability; GdBCO coated conductor tapes; GdBa2Cu3O7-x; SUS lamination; brass lamination; lamination materials; minimum quench energy; no-insulation racetrack coils wound; normal zone propagation velocities; quench initiation; quench propagation; thermal conductivity; thermal quench behaviors; thermal stability; Coils; Heating; High-temperature superconductors; Integrated circuits; Lamination; Thermal conductivity; Thermal stability; Lamination; minimum quench energy (MQE); no-insulation (NI); normal zone propagation velocity (NZPV); thermal stability;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2013.2282501
Filename :
6606859
Link To Document :
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