Title :
A numerically efficient method for the hydrodynamic density-gradient model
Author :
Jin, Seonghoon ; Park, Young June ; Min, Hong Shick
Author_Institution :
Sch. of Electr. Eng.& Comput. Sci., Seoul Nat. Univ., South Korea
Abstract :
We propose a quantum transport model that is a hydrodynamic extension of the density-gradient model. The governing equations are derived from the moments of the Wigner distribution function and their forms are suitable for the conventional device simulation program. The model is discretized by the control volume method with nonlinear discretizations for the electron and energy flux equations. We also developed a boundary condition for the Si/SiO/sub 2/ interface that includes the electron wavefunction penetration into the oxide to obtain more accurate C-V characteristics. As an application, we studied a 25 nm NMOSFET device. Compared with the semiclassical models, the new model predicts reduced gate capacitance about 20% and increased subthreshold slope and DIBL about 16% and 46% respectively. Compared with the density-gradient model, the on-current is increased up to 26% due to the nonlocal transport effect.
Keywords :
MOSFET; Wigner distribution; capacitance; density functional theory; elemental semiconductors; hydrodynamics; quantum interference phenomena; semiconductor device models; semiconductor-insulator boundaries; silicon; silicon compounds; 25 nm; C-V characteristics; DIBL; NMOSFET device; Si-SiO/sub 2/; Si/SiO/sub 2/ interface; Wigner distribution function; boundary condition; control volume method; density-gradient model; device simulation; electron flux equations; electron wavefunction penetration; energy flux equations; hydrodynamic density-gradient model; nonlinear discretizations; nonlocal transport; numerically efficient method; on-current; quantum transport model; reduced gate capacitance; subthreshold slope; Boundary conditions; Charge carrier processes; Electron mobility; Hydrodynamics; Kinetic energy; MOSFET circuits; Nonlinear equations; Poisson equations; Predictive models; Temperature;
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. International Conference on
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7826-1
DOI :
10.1109/SISPAD.2003.1233687