• DocumentCode
    2096869
  • Title

    Research and Development of MFNS Software Based on Software Engineering

  • Author

    You, D.D. ; Li, W.F. ; Shao, M.

  • Author_Institution
    Sch. of Mech. & Automotive Eng., South China Univ. of Technol., Guangzhou, China
  • Volume
    2
  • fYear
    2008
  • fDate
    20-22 Dec. 2008
  • Firstpage
    259
  • Lastpage
    263
  • Abstract
    The special mold temperature control (MTC) foundry numerical computational software MFNS was developed based on software engineering theory. The researches on mathematical models of MTC foundry process including heat transfer equation and finite element numerical model were done. In software requirement analysis, the system logic model was established by the data flow diagram and data dictionary. On a base of the logic model, the system architecture was build, and ten modules were designed to compute latent, solve equations and implement other corresponding functions. As to MTC units, a computational model and control algorithm were presented. This method in which the MTC units can be automatic controlled is closer to the real process. By comparing computational results with the experimental data, the relative errors are less than 8%. Then the software was validated.
  • Keywords
    casting; data flow analysis; finite element analysis; production engineering computing; software engineering; MFNS software; data dictionary; data flow diagram; finite element numerical model; heat transfer equation; mathematical models; mold temperature control foundry numerical computational software; software engineering; software requirement analysis; system logic model; Automatic control; Equations; Finite element methods; Foundries; Heat transfer; Mathematical model; Numerical models; Research and development; Software engineering; Temperature control; foundry; mold temperature control; numerical simulation; software engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Science and Computational Technology, 2008. ISCSCT '08. International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-3746-7
  • Type

    conf

  • DOI
    10.1109/ISCSCT.2008.45
  • Filename
    4731616