• DocumentCode
    2096932
  • Title

    Examination of electronic module immunity using transfer functions

  • Author

    Chen, Chingchi

  • Author_Institution
    Sustainable Mobility Technol., Ford Motor Co., Dearborn, MI, USA
  • Volume
    3
  • fYear
    2005
  • fDate
    8-12 Aug. 2005
  • Firstpage
    756
  • Abstract
    In this paper, the immunity of electronic modules to external electromagnetic interference (EMI) was evaluated using transfer functions, which correlate the external disturbances with the noise encountered by the components inside the module. Simple lumped-circuit models are used to describe noise coupling mechanisms, and they can be verified by straight-forward test procedures. Based on these simple models, the dominant coupling mechanisms were identified and mitigation effectiveness verified. This approach was utilized to examine an electronic module with immunity weaknesses. The module was first studied on-bench, at no power. Counter measures were then applied and effectiveness quantified. This component was then tested on a functional vehicle, with measured effectiveness matching on-bench predictions flawlessly.
  • Keywords
    circuit noise; electromagnetic interference; lumped parameter networks; transfer functions; EMI; electromagnetic interference; electronic module immunity; functional vehicle; immunity weaknesses; lumped-circuit models; noise coupling mechanisms; transfer functions; Automotive engineering; Circuit noise; Consumer electronics; Electromagnetic compatibility; Electromagnetic interference; Immunity testing; Noise figure; Noise reduction; Transfer functions; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2005. EMC 2005. 2005 International Symposium on
  • Print_ISBN
    0-7803-9380-5
  • Type

    conf

  • DOI
    10.1109/ISEMC.2005.1513625
  • Filename
    1513625