DocumentCode
2096932
Title
Examination of electronic module immunity using transfer functions
Author
Chen, Chingchi
Author_Institution
Sustainable Mobility Technol., Ford Motor Co., Dearborn, MI, USA
Volume
3
fYear
2005
fDate
8-12 Aug. 2005
Firstpage
756
Abstract
In this paper, the immunity of electronic modules to external electromagnetic interference (EMI) was evaluated using transfer functions, which correlate the external disturbances with the noise encountered by the components inside the module. Simple lumped-circuit models are used to describe noise coupling mechanisms, and they can be verified by straight-forward test procedures. Based on these simple models, the dominant coupling mechanisms were identified and mitigation effectiveness verified. This approach was utilized to examine an electronic module with immunity weaknesses. The module was first studied on-bench, at no power. Counter measures were then applied and effectiveness quantified. This component was then tested on a functional vehicle, with measured effectiveness matching on-bench predictions flawlessly.
Keywords
circuit noise; electromagnetic interference; lumped parameter networks; transfer functions; EMI; electromagnetic interference; electronic module immunity; functional vehicle; immunity weaknesses; lumped-circuit models; noise coupling mechanisms; transfer functions; Automotive engineering; Circuit noise; Consumer electronics; Electromagnetic compatibility; Electromagnetic interference; Immunity testing; Noise figure; Noise reduction; Transfer functions; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2005. EMC 2005. 2005 International Symposium on
Print_ISBN
0-7803-9380-5
Type
conf
DOI
10.1109/ISEMC.2005.1513625
Filename
1513625
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