• DocumentCode
    2096992
  • Title

    A new method for simulation of on-chip interconnects and substrate currents with 3D alternating-direction-implicit (ADI) Maxwell solver

  • Author

    Shao, Xi ; Goldsman, Neil ; Ramahi, Omar ; Guzdar, Parvez N.

  • Author_Institution
    Space Phys. Data Facility, NASA Goddard Space Flight Center, Greenbelt, MD, USA
  • fYear
    2003
  • fDate
    3-5 Sept. 2003
  • Firstpage
    315
  • Lastpage
    318
  • Abstract
    We introduce a time-domain method to simulate the digital signal propagation along on-chip interconnects by solving Maxwell´s equations with the Alternating-Direction-Implicit (ADI) method. With this method, we are able to resolve the large scale (i.e. on-chip electromagnetic wave propagation) and fine scale (i.e. skin depth and substrate current) structure in the same simulation, and the simulation time step is not limited by the Courant condition. The simulations allow us to calculate in detail parasitic current flow inside the substrate; propagation losses; skin-depth; and dispersion of digital signals on non-ideal interconnects. We have found considerable substrate currents and losses that depend on the substrate doping.
  • Keywords
    Maxwell equations; electromagnetic wave propagation; semiconductor device models; skin effect; time-domain analysis; 3D alternating-direction-implicit Maxwell solver; Courant condition; digital signal propagation; digital signals dispersion; on-chip electromagnetic wave propagation; on-chip interconnects; parasitic current flow; propagation losses; simulation; skin depth; substrate current; substrate currents; time-domain method; Differential algebraic equations; Doping; Electromagnetic propagation; Finite difference methods; Magnetic fields; Maxwell equations; Physics; Propagation losses; Semiconductor process modeling; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. International Conference on
  • Conference_Location
    Boston, MA, USA
  • Print_ISBN
    0-7803-7826-1
  • Type

    conf

  • DOI
    10.1109/SISPAD.2003.1233700
  • Filename
    1233700