DocumentCode :
2097184
Title :
Multilayer piezocomposite ultrasonic transducers operating below 50 kHz
Author :
Cochran, A. ; Hayward, G. ; Murray, V.
Author_Institution :
Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
Volume :
2
fYear :
1999
fDate :
1999
Firstpage :
953
Abstract :
Ultrasonic transducers operating below 50 kHz have applications in sonar, process ultrasound, and low frequency nondestructive evaluation. The most common structure is the Tonpilz mass-spring design. In contrast, multilayer piezocomposite transducers are reported here. The electrical impedance of these devices can be controlled by the number and thickness of layers and the acoustic impedance by ceramic volume fraction. The transducers described in this paper have been designed using finite element analysis and linear systems modeling. Typical design output is presented and results from prototype devices are presented. These show that it is not easy to obtain a quality factor less than 5, but that excellent sensitivity is possible. It is concluded that multilayer piezocomposites have benefits, for example in terms of sensitivity, and costs, for example in terms of increased manufacturing complexity
Keywords :
composite materials; piezoceramics; piezoelectric thin films; sonar arrays; ultrasonic materials testing; ultrasonic transducers; Tonpilz mass-spring design; acoustic impedance; ceramic volume fraction; design output; electrical impedance; finite element analysis; linear systems modeling; low frequency nondestructive evaluation; multilayer piezocomposite ultrasonic transducers; multilayer piezocomposites; process ultrasound; quality factor; sonar; Acoustic devices; Acoustic transducers; Ceramics; Frequency; Impedance; Nonhomogeneous media; Sonar applications; Thickness control; Ultrasonic imaging; Ultrasonic transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 1999. Proceedings. 1999 IEEE
Conference_Location :
Caesars Tahoe, NV
ISSN :
1051-0117
Print_ISBN :
0-7803-5722-1
Type :
conf
DOI :
10.1109/ULTSYM.1999.849146
Filename :
849146
Link To Document :
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