Title :
Extension of the compression approach to include device metalizations in electromagnetic simulations
Author :
Ooms, S. ; De Zutter, Daniel
Author_Institution :
Dept. of Inf. Technol., Univ. of Gent, Belgium
Abstract :
A new technique for the combination of electromagnetic field simulations and analysis of complex active circuits is proposed, allowing the incorporation of the passive metalization of active components into electromagnetic simulations.
Keywords :
active networks; circuit analysis computing; digital simulation; electromagnetic fields; metallisation; passive networks; active circuits; active components; compression approach; device metalizations; electromagnetic field analysis; electromagnetic field simulation; electromagnetic simulations; passive metalization; Active circuits; Analytical models; Circuit simulation; Electromagnetic analysis; Electromagnetic devices; Electromagnetic fields; Information analysis; Information technology; Message-oriented middleware; Voltage;
Conference_Titel :
Antennas and Propagation Society International Symposium, 1995. AP-S. Digest
Conference_Location :
Newport Beach, CA, USA
Print_ISBN :
0-7803-2719-5
DOI :
10.1109/APS.1995.530198
