Title :
Advanced MEMS ferroelectric ultrasound 2D arrays
Author :
Bernstein, J.J. ; Bottari, J. ; Houston, K. ; Kirkos, G. ; Miller, R. ; Xu, B. ; Ye, Y. ; Cross, L.E.
Author_Institution :
Charles Stark Draper Lab. Inc., Cambridge, MA, USA
Abstract :
This paper discusses the: design of advanced micromachined ferroelectric ultrasound transducers for use at 3 MHz. 16×16 arrays of resonant monomorph sensors have been constructed, with sol-gel PZT as the active ferroelectric layer deposited on insulating layers of ZrO2 and SiO2. A novel in-plane polarization of the PZT is used to maximize sensitivity, while trading off reduced output capacitance to match the CMOS buffer electronics. This results in about 30 dB improved sensitivity compared to conventional polarizing across the thickness of the PZT layer. Fluid-filled through wafer holes are used as an acoustic matching network to achieve resonance at both 1 and 3 MHz. A lumped element equivalent circuit model will be presented, as well as Finite Element Analysis showing frequency response and resonant gain. Performance predictions for projector efficiency and receive response are given. Test results are presented including transmit response, receive sensitivity, and frequency response
Keywords :
equivalent circuits; ferroelectric devices; finite element analysis; lead compounds; micromachining; microsensors; sol-gel processing; ultrasonic transducer arrays; 2D array; 3 MHz; CMOS buffer electronics; MEMS ferroelectric ultrasound transducer; PZT; PZT sol-gel layer; PbZrO3TiO3; acoustic matching network; capacitance; finite element analysis; frequency response; in-plane polarization; lumped element equivalent circuit model; micromachining; projector efficiency; resonant gain; resonant monomorph sensor; sensitivity; thickness mode; Ferroelectric materials; Frequency response; Insulation; Micromechanical devices; Polarization; Resonance; Sensor arrays; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers;
Conference_Titel :
Ultrasonics Symposium, 1999. Proceedings. 1999 IEEE
Conference_Location :
Caesars Tahoe, NV
Print_ISBN :
0-7803-5722-1
DOI :
10.1109/ULTSYM.1999.849201