• DocumentCode
    2098353
  • Title

    Coupling and packaging issues of silicon based photonic integrated circuits

  • Author

    Kopp, C. ; Bernabe, S. ; Fowler, D. ; Grosse, P. ; Fedeli, Jean-Marc ; Menezo, Sylvie

  • Author_Institution
    LETI, CEA, Grenoble, France
  • fYear
    2012
  • fDate
    7-10 Nov. 2012
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    We review the two opposing challenges that fiber coupling of silicon photonic circuits has to deal with. The first being high performance with different requirements for emitters and receivers. The second being that of packaging assembly tolerances.
  • Keywords
    assembling; elemental semiconductors; integrated circuit packaging; integrated optics; optical fibre couplers; silicon; Si; coupling issues; packaging assembly tolerances; packaging issues; silicon based photonic integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications and Photonics Conference (ACP), 2012 Asia
  • Conference_Location
    Guangzhou
  • ISSN
    2162-108X
  • Print_ISBN
    978-1-4673-6274-0
  • Type

    conf

  • Filename
    6510980
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2098353