Title :
Coupling and packaging issues of silicon based photonic integrated circuits
Author :
Kopp, C. ; Bernabe, S. ; Fowler, D. ; Grosse, P. ; Fedeli, Jean-Marc ; Menezo, Sylvie
Author_Institution :
LETI, CEA, Grenoble, France
Abstract :
We review the two opposing challenges that fiber coupling of silicon photonic circuits has to deal with. The first being high performance with different requirements for emitters and receivers. The second being that of packaging assembly tolerances.
Keywords :
assembling; elemental semiconductors; integrated circuit packaging; integrated optics; optical fibre couplers; silicon; Si; coupling issues; packaging assembly tolerances; packaging issues; silicon based photonic integrated circuits;
Conference_Titel :
Communications and Photonics Conference (ACP), 2012 Asia
Conference_Location :
Guangzhou
Print_ISBN :
978-1-4673-6274-0
