Title :
Ultrasonic transducer with thermo mechanical excitation and piezoresistive detection
Author :
Popescu, Dan S. ; Duscalu, D.C. ; Elwenspoek, Miko ; Lammerink, Theo
Author_Institution :
Dept. of Electron., Univ. Politehnica Bucharest, Romania
Abstract :
Ultrasonic transducer was fabricated from silicon buckled membrane using a thermo mechanical excitation and piezoresistive detection. The transducer has a 4 mm square silicon membrane, buckled with an initial deflection of 20 μm, actuated by dynamically heating an aluminium ring layer, 3 μm thick, with a polysilicon ring resistor. Detection is made by measuring the piezoresistive component in the polysilicon layer impedance
Keywords :
buckling; electric impedance measurement; elemental semiconductors; membranes; micromachining; micromechanical devices; piezoresistive devices; silicon; thermomechanical treatment; ultrasonic transducers; 3 mum; 4 mm; Si; Si buckled membrane; Si membrane; aluminium ring layer; buckling; deflection; dynamically heating; piezoresistive detection; polysilicon layer impedance; polysilicon ring resistor; thermo mechanical excitation; ultrasonic transducer; Biomembranes; Compressive stress; Elasticity; Heating; Piezoresistance; Resistors; Silicon; Thickness measurement; Ultrasonic transducers; Vibrations;
Conference_Titel :
Semiconductor Conference, 1996., International
Conference_Location :
Sinaia
Print_ISBN :
0-7803-3223-7
DOI :
10.1109/SMICND.1996.557311
