• DocumentCode
    2102153
  • Title

    A design of touch detection algorithm for bonding tip of wire bonder machine

  • Author

    Kim, Jung-Han ; Oh, Jun-Ho

  • Author_Institution
    Precision Instrum. R&D Center, Samsung Techwin, Sungnam, South Korea
  • Volume
    1
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    621
  • Abstract
    This paper describes a design of touch detection algorithm of bonding tip in gold wire bonding process. It contains a new design of a detection algorithm for capillary contact on pad and lead in the wire bonding process of interconnection between pads and leads. The design method is developed by a systematic approach from the viewpoint of handling the risk of false detection based on not trial and error but on statistical analysis. The paper shows a systematic approach to the design of a velocity estimator and touch detection algorithm for a bonding tip by introducing the concept of the optimal estimator. The statistical approach provides more convenient and powerful tools for managing the risk of false contact detection or velocity estimate, which leads to more stable detection time and finally more stable bonding quality. Real wire bonding experimental results are presented to demonstrate the advantages of the proposed algorithm
  • Keywords
    integrated circuit interconnections; joining processes; semiconductor device packaging; statistical analysis; wires (electric); bonding tip; capillary contact; false detection risk handling; gold wire bonding process; low cost packaging technology; semiconductor package; stable bonding quality; stable detection time; statistical analysis; touch detection algorithm; velocity estimator design; Algorithm design and analysis; Bonding processes; Design methodology; Detection algorithms; Energy management; Gold; Quality management; Risk management; Statistical analysis; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, 2001. IECON '01. The 27th Annual Conference of the IEEE
  • Conference_Location
    Denver, CO
  • Print_ISBN
    0-7803-7108-9
  • Type

    conf

  • DOI
    10.1109/IECON.2001.976557
  • Filename
    976557