• DocumentCode
    2102447
  • Title

    Effect of Au thickness on laser beam penetration in Invar-to-Invar packages

  • Author

    Wang, S.C. ; Chang, H.L. ; Wang, C. ; Wang, C.M. ; Liaw, J.W. ; Sheen, M.T. ; Sheu, Y.C. ; Kuang, J.H. ; Chi, S. ; Yang, Y.D. ; Cheng, W.H.

  • Author_Institution
    Telecommun. Labs., Taoyuan, Taiwan
  • fYear
    1997
  • fDate
    18-21 May 1997
  • Firstpage
    1272
  • Lastpage
    1276
  • Abstract
    Comprehensive measurements of the dependence of the laser beam penetration on the Au coating thickness in laser welding techniques for semiconductor laser packages are presented. The results obtained from the Invar-Invar joints Show that the welded joints with thick Au coating exhibit narrower weld width, shallower penetration, and hence less joint strength than those the package joints with thin Au coating. A finite-element-method (FEM) is done of the effect of laser beam penetration On the Au thickness in the Invar-Invar joints. This method has been employed successfully to predict the laser beam penetration in laser welded Au-coated materials that the weld width and the penetration depth are found to be reduced as the Au coating thickness increases. The likely cause for the reduction is due to the increased thermal conduction of thicker Au in the welded region. Detailed knowledge of the effect of Au coating thickness on laser beam penetration is important for practical design and fabrication of reliable optoelectronic packaging having laser welded Au-coated materials
  • Keywords
    Invar; finite element analysis; gold; laser beam welding; semiconductor device packaging; semiconductor lasers; Au; Au coating; Invar-Invar joint; design; fabrication; finite element method; laser beam penetration; laser welding; optoelectronic packaging; semiconductor laser; thermal conduction; Coatings; Conducting materials; Finite element methods; Gold; Laser beams; Optical materials; Semiconductor device packaging; Semiconductor lasers; Thickness measurement; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1997. Proceedings., 47th
  • Conference_Location
    San Jose, CA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-3857-X
  • Type

    conf

  • DOI
    10.1109/ECTC.1997.606339
  • Filename
    606339