• DocumentCode
    2102546
  • Title

    Competence model for embedded micro-and nanosystems

  • Author

    Schäfer, André ; Brück, Rainer ; Kleinert, Bruno ; Schmidt, Harald ; Fey, Dietmar ; Büchner, Steffen ; Jaschke, Steffen ; Schubert, Sigrid

  • Author_Institution
    Inst. of Microsyst. Technol., Univ. of Siegen, Siegen, Germany
  • fYear
    2012
  • fDate
    17-20 April 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this paper, we describe the results of an expert survey conducted within the project “Competence development with embedded micro- and nanosystems”. This survey was designed in order to refine our previously derived normative competence structure model for developers of embedded micro-and nanosystems towards an empirically refined competence structure model. Today the size of structural parts of nanosystems has scaled down to as few as a couple of molecules. This results in a lot of challenges regarding permanent and transient faults. Therefore bottom-up development techniques for nanostructured systems are now included into our competence model to prepare future developers to the specific challenges of designing at the nano scale. The evaluation of the content validity of the empirically refined competence structure model was accomplished by the presented expert rating.
  • Keywords
    embedded systems; software fault tolerance; bottom-up development technique; embedded microsystem; embedded nanosystem; expert rating; nanostructured system; normative competence structure model; permanent fault; refined competence structure model; transient fault; Computer science; Educational institutions; Embedded systems; Hardware; Mathematics; competence development; embedded systems; fault tolerance; nanoelectronics; parallel processing; redundancy; systems engineering education;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Global Engineering Education Conference (EDUCON), 2012 IEEE
  • Conference_Location
    Marrakech
  • ISSN
    2165-9559
  • Print_ISBN
    978-1-4673-1457-2
  • Electronic_ISBN
    2165-9559
  • Type

    conf

  • DOI
    10.1109/EDUCON.2012.6201062
  • Filename
    6201062