DocumentCode :
2102569
Title :
Theory of optimal pulse shaping for plasma processing
Author :
Vincent, Tyrone L. ; Raja, Laxminaryan L.
Author_Institution :
Eng. Div., Colorado Sch. of Mines, Golden, CO, USA
Volume :
6
fYear :
2002
fDate :
2002
Firstpage :
5119
Abstract :
Thin film etching and deposition using low pressure plasma reactors is an integral part of the fabrication of VLSI circuits. This paper discusses the numerical calculation of periodic inputs to achieve desired operating conditions in low pressure plasma reactors. A gradient method is used to optimize the average value of state variables.
Keywords :
gradient methods; integrated circuit manufacture; optimal control; process control; sputter etching; thin film circuits; IC fabrication; VLSI; gradient method; optimal pulse shaping; plasma dynamic model; plasma reactors; thin film deposition; thin film etching; Etching; Fabrication; Gradient methods; Inductors; Plasma applications; Plasma materials processing; Pulse shaping methods; Sputtering; Thin film circuits; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
American Control Conference, 2002. Proceedings of the 2002
ISSN :
0743-1619
Print_ISBN :
0-7803-7298-0
Type :
conf
DOI :
10.1109/ACC.2002.1025479
Filename :
1025479
Link To Document :
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