• DocumentCode
    2102752
  • Title

    Conjugate Numerical Investigation of Flow and Heat Transfer in a Novel Porous Micro Heat Sink

  • Author

    Wan Junhua ; Wan Zhongmin ; Liu Jing ; Chen Huanxin ; Tu Zhengkai

  • Author_Institution
    Dept. of Phys. & Electron. Inf., Hunan Inst. of Sci. & Technol., Yueyang, China
  • fYear
    2010
  • fDate
    28-31 March 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A novel porous micro heat sink system is presented for dissipating high heat flux of electronic devices. Numerical model for the micro heat sink is proposed to describe heat transfer in the metallic wall and liquid flow and heat transfer in the porous wick structure, and it is solved with SIMPLE algorithm as a conjugate problem. The numerical results showed that the heated surface temperature of porous micro heat sink is low at high heat fluxes. Increasing inlet fluid velocity can greatly decrease the temperatures of the heated surface temperature and bottom surface. The temperature of the heated surface can maintain good isothermal characteristic when inlet located in the bottom of micro heat sink.
  • Keywords
    electronics industry; heat sinks; heat transfer; SIMPLE algorithm; dissipating high heat flux; electronic devices; heat transfer; inlet fluid velocity; liquid flow; metallic wall; porous micro heat sink system; porous wick structure; Electronics packaging; Fluid flow; Heat engines; Heat pumps; Heat sinks; Heat transfer; Numerical models; Space heating; Space technology; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power and Energy Engineering Conference (APPEEC), 2010 Asia-Pacific
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-4812-8
  • Electronic_ISBN
    978-1-4244-4813-5
  • Type

    conf

  • DOI
    10.1109/APPEEC.2010.5448804
  • Filename
    5448804