DocumentCode
2102752
Title
Conjugate Numerical Investigation of Flow and Heat Transfer in a Novel Porous Micro Heat Sink
Author
Wan Junhua ; Wan Zhongmin ; Liu Jing ; Chen Huanxin ; Tu Zhengkai
Author_Institution
Dept. of Phys. & Electron. Inf., Hunan Inst. of Sci. & Technol., Yueyang, China
fYear
2010
fDate
28-31 March 2010
Firstpage
1
Lastpage
4
Abstract
A novel porous micro heat sink system is presented for dissipating high heat flux of electronic devices. Numerical model for the micro heat sink is proposed to describe heat transfer in the metallic wall and liquid flow and heat transfer in the porous wick structure, and it is solved with SIMPLE algorithm as a conjugate problem. The numerical results showed that the heated surface temperature of porous micro heat sink is low at high heat fluxes. Increasing inlet fluid velocity can greatly decrease the temperatures of the heated surface temperature and bottom surface. The temperature of the heated surface can maintain good isothermal characteristic when inlet located in the bottom of micro heat sink.
Keywords
electronics industry; heat sinks; heat transfer; SIMPLE algorithm; dissipating high heat flux; electronic devices; heat transfer; inlet fluid velocity; liquid flow; metallic wall; porous micro heat sink system; porous wick structure; Electronics packaging; Fluid flow; Heat engines; Heat pumps; Heat sinks; Heat transfer; Numerical models; Space heating; Space technology; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Power and Energy Engineering Conference (APPEEC), 2010 Asia-Pacific
Conference_Location
Chengdu
Print_ISBN
978-1-4244-4812-8
Electronic_ISBN
978-1-4244-4813-5
Type
conf
DOI
10.1109/APPEEC.2010.5448804
Filename
5448804
Link To Document