2102815

Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)

2002

12-12 July 2002

failure analysis; integrated circuit reliability; EOS; ESD; MEMS; device reliability; dielectric reliability; electromigration; failure analysis; hot carriers; integrated circuits; interconnects; packaging; physical analysis; process reliability;

English

ieee

Physical and Failure Analysis of Integrated Circuits, 2002. IPFA 2002. Proceedings of the 9th International Symposium on the

Singapore

0-7803-7416-9

conf

10.1109/IPFA.2002.1025601

1025601